X1H008000DI1H-HW晶振,台湾加高5032晶体,笔记本电脑晶振
频率:8MHZ
尺寸:5032mm
X1H008000DI1H-HW晶振,台湾加高5032晶体,笔记本电脑晶振,台湾HELE晶振公司,小尺寸晶振,耐高温晶振,耐冲击晶振,无源晶振,贴片晶振,5032晶振,石英晶振,超小型晶振,低损耗晶振,高品质晶振,高精度晶振,程控交换机晶振,无人机晶振。特点:超小型贴片型晶体器件。精度高,可靠性好,耐热性好。适用于设计空间有限的智能手机应用程序、初始化无线模块设备、RFID应用程序和其他基于消费者的产品.
X1H008000DI1H-HW晶振,台湾加高5032晶体,笔记本电脑晶振
项目 | HSX531S | |||
频率范围 | 8 ~ 10 MHz | 10 ~ 12 MHz | 12 ~ 40 MHz | 40 ~ 80 MHz |
工作模式 | Fundamental | 3rd Overtone | ||
频率容差 | ±10ppm, ±20ppm, or Specify | |||
温度范围内的频率稳定度 | ±10ppm, ±15ppm, ±20ppm, or Specify | |||
工作温度 | -10 ~ +60 ℃ , or Specify | |||
负载电荷 | Series, 8pF, 10pF, 12pF, 16pF or Specify | |||
驱动电平 | 10μW (300μW Max.) | |||
等效串联电阻 | 150Ω Max. | 80Ω Max. | 50Ω Max. | 70Ω Max. |
储存温度范围 | -40 ~ +125℃ |
X1H008000DI1H-HW晶振,台湾加高5032晶体,笔记本电脑晶振
原厂编码 | 生产商 | 型号 | 频率 | 频率容差 | 负载电容 | 工作温度 |
X5H008000DC1H-W | 加高晶振 | HSX530G | 8 MHz | ±20ppm | 12pF | -20°C ~ 70°C |
X5H008000FC1H-X | 加高晶振 | HSX530G | 8 MHz | ±30ppm | 12pF | -20°C ~ 70°C |
X5H008000FF1H | 加高晶振 | HSX530G | 8 MHz | ±30ppm | 15pF | -10°C ~ 60°C |
X5H008000DK1H | 加高晶振 | HSX530G | 8 MHz | ±50ppm | 20pF | -10°C ~ 60°C |
X5H008000FK1H-X | 加高晶振 | HSX530G | 8 MHz | ±50ppm | 20pF | -40°C ~ 85°C |
X5H008000IK1H-H | 加高晶振 | HSX530G | 8 MHz | ±50ppm | 20pF | -20°C ~ 70°C |
X5H012288FI1H | 加高晶振 | HSX530G | 12.288 MHz | ±30ppm | 18pF | -20°C ~ 75°C |
X5H012000FC1H-X | 加高晶振 | HSX530G | 12 MHz | ±50ppm | 12pF | -40°C ~ 85°C |
X5H013560FC1H-X | 加高晶振 | HSX530G | 13.56 MHz | ±30ppm | 12pF | -20°C ~ 70°C |
X5H01431AFK1H-X | 加高晶振 | HSX530G | 14.31818 MHz | ±30ppm | 20pF | -20°C ~ 70°C |
X5H015360FK1H-X | 加高晶振 | HSX530G | 15.36 MHz | ±50ppm | 20pF | -40°C ~ 85°C |
X5H022118DK1H-W | 加高晶振 | HSX530G | 22.1184 MHz | ±20ppm | 20pF | -20°C ~ 70°C |
X5H024000DC1H-X | 加高晶振 | HSX530G | 24 MHz | ±30ppm | 12pF | -20°C ~ 70°C |
X5H025000DK1H | 加高晶振 | HSX530G | 25 MHz | ±30ppm | 20pF | -10°C ~ 60°C |
X5H025000FK1H-X | 加高晶振 | HSX530G | 25 MHz | ±30ppm | 20pF | -10°C ~ 70°C |
X1H016000FI1H-X | 加高晶振 | HSX531 | 16 MHz | ±30ppm | 18pF | -20°C ~ 70°C |
X1H008000DC1H-U | 加高晶振 | HSX531S | 8 MHz | ±20ppm | 12pF | -30°C ~ 85°C |
X1H008000DI1H-HW | 加高晶振 | HSX531S | 8 MHz | ±20ppm | 18pF | -20°C ~ 70°C |
X1H008000DK1H-X | 加高晶振 | HSX531S | 8 MHz | ±50ppm | 20pF | -30°C ~ 85°C |
X1H012000FK1H | 加高晶振 | HSX531S | 12 MHz | ±50ppm | 7pF | -10°C ~ 85°C |
X1H012000FK1H-X | 加高晶振 | HSX531S | 12 MHz | ±50ppm | 20pF | -10°C ~ 85°C |
X1H016000FK1H-X | 加高晶振 | HSX531S | 16 MHz | ±50ppm | 20pF | -10°C ~ 85°C |
X1H020000FK1H-X | 加高晶振 | HSX531S | 20 MHz | ±50ppm | 20pF | -20°C ~ 85°C |
X1H022118DK1H | 加高晶振 | HSX531S | 22.1184 MHz | ±50ppm | 20pF | -10°C ~ 60°C |
X1H022118FK1H-V | 加高晶振 | HSX531S | 22.1184 MHz | ±30ppm | 20pF | -40°C ~ 85°C |
X1H025000FK1H | 加高晶振 | HSX531S | 25 MHz | ±30ppm | 20pF | -10°C ~ 60°C |
X1H025000FK1HA-X | 加高晶振 | HSX531S | 25 MHz | ±50ppm | 20pF | -40°C ~ 85°C |
X1H027000DK1H-HV | 加高晶振 | HSX531S | 27 MHz | ±20ppm | 20pF | -20°C ~ 75°C |
X1H008000DC1H-U | 加高晶振 | HSX531S | 8 MHz | ±20ppm | 12pF | -30°C ~ 85°C |
X1H008000DI1H-HW | 加高晶振 | HSX531S | 8 MHz | ±20ppm | 7pF | -20°C ~ 70°C |
X1H025000FK1H | 加高晶振 | HSX531S | 25 MHz | ±30ppm | 20pF | -10°C ~ 60°C |
X1H025000FK1HA-X | 加高晶振 | HSX531S | 25 MHz | ±50ppm | 20pF | -40°C ~ 85°C |
X5H008000DK1H | 加高晶振 | HSX530G | 8 MHz | ±50ppm | 20pF | -10°C ~ 60°C |
X5H008000FC1H-X | 加高晶振 | HSX530G | 8 MHz | ±30ppm | 12pF | -20°C ~ 70°C |
X5H008000FF1H | 加高晶振 | HSX530G | 8 MHz | ±30ppm | 15pF | -10°C ~ 60°C |
X5H012000FC1H-X | 加高晶振 | HSX530G | 12 MHz | ±50ppm | 12pF | -40°C ~ 85°C |
X5H022118DK1H-W | 加高晶振 | HSX530G | 22.1184 MHz | ±20ppm | 20pF | -20°C ~ 70°C |
精工富士晶振-康华尔正规渠道指定供应商
服务热线:0755-27838351
手机联系:138-2330-0879
Q Q联系:632862232
邮 箱:konuaer@163.com
地 址:广东深圳市宝安区宝安大道东95号浙商大厦1905
采购:X1H008000DI1H-HW晶振,台湾加高5032晶体,笔记本电脑晶振
- *联系人:
- *手机:
- 公司名称:
- 邮箱:
- *采购意向:
-
*验证码:
跟此产品相关的产品 / Related Products
- 瑞康晶振,2520晶振,RSX-10晶振
- 贴片石英晶体,体积小,焊接可采用自动贴片系统,产品本身小型,表面贴片晶振,特别适用于有小型化要求的电子数码产品市场领域,因产品小型,薄型优势,耐环境特性,包括耐高温,耐冲击性等,在移动通信领域得到了广泛的应用,晶振产品本身可发挥优良的电气特性,满足无铅焊接的高温回流温度曲线要求。
- Pletronics晶振,3225晶振,PE44F/PE44G晶振
- 小尺寸的TCXO温补晶振内部晶片焊接模式采用了,高精密点胶技术,晶片胶点的位置、大小:位置准确度以及胶点大小一致性,通过图像识别及高精密度数字定位系统的运用、使晶片的点胶的精度在±0.02mm之内,确保TCXO晶体产品精度,稳定性能良好发挥功能。
- 百利通亚陶晶振,石英晶振,FYQ晶振
- 贴片石英晶体,体积小,焊接可采用自动贴片系统,产品本身小型,表面贴片晶振,特别适用于有小型化要求的电子数码产品市场领域,因产品小型,薄型优势,耐环境特性,包括耐高温,耐冲击性等,在移动通信领域得到了广泛的应用,晶振产品本身可发挥优良的电气特性,满足无铅焊接的高温回流温度曲线要求.
咨询热线
![](/Skins/default/img/Common/h_tel.png)
电话:0755-27838351
手机:138 2330 0879
QQ:632862232
邮箱: konuaer@163.com
地址:广东深圳市宝安区宝安大道东95号浙商大厦1905